ROG STRIX GEFORCE RTX™ 3090
From top to bottom, the ROG Strix GeForce RTX™ 3090 has been radically improved to accommodate the impressive new Ampere chips from NVIDIA and to deliver the next wave of gaming performance innovation to the market. A fresh design and more metal surrounds a grouping of Axial-tech fans. Last gen’s uniform fan layout has been usurped by a new rotation scheme and specialized roles for central and auxiliary fans. Below the blades, a larger, more impressive heatsink is ready for the most demanding thermal loads. The PCB has some new tricks up its sleeves, and even the backplate has received some performance-boosting changes. You’ve been waiting for the latest and greatest in GPU design – and this is it.
Our Axial-tech fan design has been optimized for a new, larger heatsink that features more fins and surface area than last gen. The blade count has been increased on all three fans, with 13 on the center fan and 11 on the auxiliary fans. The barrier ring on the side fans has been slimmed down to allow for more lateral intake and to provide better airflow through the cooling array. The center fan’s extra blades and full-height ring provide boosted static pressure to blast air directly onto the GPU heat spreader.
To bolster the specialized roles of the center and auxiliary fans, the rotational direction of the center fan has been reversed. This reduces airflow turbulence inside of the cooling array for another boost to the card’s overall thermal performance.
The sum of the ROG Strix’s cooling innovations results in lower fan speeds and raises the performance threshold for achieving a sub-55 degree GPU temp, at which point the fans can shut off completely. Builders seeking quiet performance will be pleased.
To get heat up off the die and into the heatsink array to benefit from the new fan design requires special attention. We use a manufacturing process that polishes the surface of the heat spreader to improve smoothness at the microscopic level. The extra flatness allows for better contact with the die for improved thermal transfer.
The heat spreader draws heat up into heatpipes that carry it through a fin stack that fills a large 2.9-slot footprint. Increasing the heatsink size compared to the last generation provides more thermal headroom to account for the new high-performance chipset.
Top-shelf capacitors, chokes, and MOSFETs are selected to effortlessly deliver hundreds of watts at a millisecond’s notice. The Super Alloy Power II parts are soldered to the PCB using our advanced Auto-Extreme automated manufacturing process. Smooth joints on the rear of the PCB and the elimination of human errors ensures each graphics card meets our rigorous specifications.